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TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

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TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

Name: TIF1001511F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection
Brand: Ziitek
Price: 0.1 USD

Buy cheap TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection product

Model Number : TIF100-15-11F

Dielectric Breakdown Voltage(V/mm） : ≥5500

Payment Terms : T/T

Thermal Conductivity : 1.5W/mK

Color : Dark Gray

Price : 0.1-10 USD/PCS

Density : 2.2 g/cm³

Supply Ability : 100000pcs/day

Products name : Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

Brand Name : Ziitek

Application : Heat Sink Applications And Electronic Device Protection

MOQ : 1000pcs

Delivery Time : 3-5 work days

Hardness : 65/60 Shore 00

Packaging Details : 24*13*12cm cartons

Keywords : Thermal Pad

Sample : Free

Certification : UL and RoHs

Place of Origin : Vietnam

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Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

The TIF^®100-15-11F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat,and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

Features:

> Good thermal conductivity 1.5W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications:

> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF^®100-15-11F Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.2		ASTM D792
Thickness Range(inch/mm)	0.010~0.020 0.25~0.50	0.030~0.200 0.75~5.00	ASTM D374
Hardness (Shore 00)	65	60	ASTM 2240
Continuos Use Temp	-40 to 200℃		***
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1Mhz	4.5		ASTM D150
Volume Resistivity(Ohm-cm)	＞1.0X10¹²		ASTM D257
Thermal Conductivity (W/m-K)	1.5		ASTM D5470
	1.5		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection

Company Profile

Vietnam Ziitek Technology Company Limited (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

TIF100-15-11F Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection Images

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