Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink
Product descriptions
The TIF®100L 3030-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits. And the material has excellent flexibility and elasticity, which can fully fill the micro gaps between the heating interface and the heat dissipation structure, significantly reduce the contact thermal resistance,improve the thermal conductivity efficiency, and ensure the reliability and service life of electronic components in long-term operation.
Features
> Ultra low volatility of siloxane
> Good thermal conductivity
> Excellent weather resistance and aging resistance
> Highly compressible, easy to install and operate
> Good insulation performance
Applications
> Motor Controller (MCU)
> Airborne computer
> Machine vision camera
> High performance ASIC chip
> Central control screen
| Typical Properties of TIF®100L 3030-06 Series |
| Property | Value | Test method |
| Color | White | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 3.0 | ASTM D792 |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| 0.25~0.50 | 0.75~5.00 |
| Hardness (Shore 00) | 65 | 30 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Volume Resistivity(Ohm-meter) | ＞1.0X1012 | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 |
| 3.0W/m-K | ISO22007 |
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)
The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
Thermal gap pad
Thermal graphite sheet/film
Thermal double-sided tape
Thermal insulation pad
Thermal grease
Phase change material
Thermal gel
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Our services
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TIF100L 3030-06 Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Images
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