Thermal Conductive Pad Soft Compressible Silicone Material With Naturally Tacky Surface For Low Stress Electronic Cooling
Product descriptions
TlF®100-20-05E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.
Features
> Good thermal conductivity
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance
Application
> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> Heat pipe thermal solutions
> Set top boxes
> Audio and video components
> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Radiator
> AI Processors AI Servers
| Typical Properties of TIF®100-20-05E Series |
| Property |
Value |
Test method |
| Color |
Blue |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
2.5 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| 0.25~0.50 |
0.75~5.00 |
| Hardness (Shroe 00) |
65 |
35 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant@ 1MHz |
4.5 |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
2.0 W/m-K |
ASTM D5470 |
| 2.0 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in customshapes and various forms.
For other thicknesses or more information,please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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TIF100-20-05E Thermal Conductive Pad Soft Compressible Silicone Material With Naturally Tacky Surface For Low Stress Electronic Cooling Images
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